图中提示配置有问题，当即去模板数据集预览数据，发现预览没问题，再次查看还是提示 这个问题，然后想着看下是不是单元格的数据有问题，就点开了几个单元格看了看，发现没啥，然后出现保存按钮（一般有改动会出现变亮）然后点了一下保存，再次查看发现数据好了，请问有可能是什么问题 ————----sqlselect * from (select so.so_date, sm.user_name, p.prod_name, p.wafer_size, null sub_prod_name, p.package_class, so.sap_so_code, DECODE(so.order_type,'E','工程','量产') ORDER_TYPE, so.cust_lot, so.cust_po_code, so.cust_code, so.cust_name, floor(so.order_qty) order_qty, case when p.package_class ='FO-eWLB-F'and (so.round_form='U' or so.round_form is null) then --向上取整 CEIL(so.order_qty/(select attr.attr_val from md_product_layer lay ,md_product_layer_attr attr where p.row_id=lay.prod_id and attr.prod_layer_id=lay.row_id and lay.del_flag=0 and attr.del_flag=0 and attr.attr_code='D0004')) when p.package_class ='FO-eWLB-F'and so.round_form='D' then --向下取整 floor(so.order_qty/(select attr.attr_val from md_product_layer lay ,md_product_layer_attr attr where p.row_id=lay.prod_id and attr.prod_layer_id=lay.row_id and lay.del_flag=0 and attr.del_flag=0 and attr.attr_code='D0004')) else sw.wafer_qty end wafer_qty, case when so.cust_po_code='假片' then 0 when p.package_class in ('BUMP','Bumping') then 0 else sw.wafer_die_qty end wafer_die_qty, null fo_wafer_qty, wo.wo_code, mo.mo_code, lot.lot_code from so_sale_order soleft join (select sw.so_id, sum(sw.wafer_qty) wafer_qty ,sum(sw.wafer_die_qty ) wafer_die_qty from so_sale_order_wafer sw where sw.del_flag=0 group by sw.so_id ) sw on sw.so_id=so.row_id left join wo_work_order wo on so.row_id=wo.so_id and wo.del_flag=0left join mo_order mo on wo.row_id=mo.wo_id and mo.del_flag=0left join lot_info lot on mo.row_id=lot.mo_id and lot.del_flag=0left join md_product p on so.prod_id=p.row_id and p.del_flag=0left join sm_user sm on so.create_user_id =sm.row_id --left join ( select g.* from md_prod_segment_group g where g.del_flag=0 and g.WAFER_U='1' ) fo on p.row_id= fo.prod_id where so.prod_line='W' and so.del_flag=0--and so.biz_status='Y'and (/*lot.lot_status='LotDispatch' or */lot.lot_code is null or mo.mo_code is null or wo.wo_code is null )union allselect so.so_date, sm.user_name, fo.sub_prod_name prod_name, p.wafer_size, '磨划型号' sub_prod_name, p.package_class, so.sap_so_code, DECODE(so.order_type,'E','工程','量产') ORDER_TYPE, so.cust_lot, so.cust_po_code, so.cust_code, so.cust_name, sw.wafer_qty order_qty, sw.wafer_qty wafer_qty, null wafer_die_qty, null fo_wafer_qty, wo.wo_code, mo.mo_code, lot.lot_code from so_sale_order soleft join (select sw.so_id, sum(sw.wafer_qty) wafer_qty ,sum(sw.wafer_die_qty ) wafer_die_qty from so_sale_order_wafer sw where sw.del_flag=0 group by sw.so_id ) sw on sw.so_id=so.row_id left join wo_work_order wo on so.row_id=wo.so_id and wo.del_flag=0left join mo_order mo on wo.row_id=mo.wo_id and mo.del_flag=0left join lot_info lot on mo.row_id=lot.mo_id and lot.del_flag=0left join md_product p on so.prod_id=p.row_id and p.del_flag=0left join sm_user sm on so.create_user_id =sm.row_id left join ( select g.* from md_prod_segment_group g where g.del_flag=0 and g.WAFER_U='1' ) fo on p.row_id= fo.prod_id where so.prod_line='W' and so.del_flag=0--and so.biz_status='Y'and (/*lot.lot_status='LotDispatch' or */lot.lot_code is null or mo.mo_code is null or wo.wo_code is null )and p.package_class='FO-eWLB-F') t where t.so_date >= sysdate - 30order by t.sap_so_code ,t.sub_prod_name desc
