图中提示配置有问题，当即去模板数据集预览数据，发现预览没问题，再次查看还是提示 这个问题，然后想着看下是不是单元格的数据有问题，就点开了几个单元格看了看，发现没啥，然后出现保存按钮（一般有改动会出现变亮）然后点了一下保存，再次查看发现数据好了，请问有可能是什么问题  

————----sql

select * from (

select so.so_date,

       sm.user_name, 

       p.prod_name,

p.wafer_size,

       null sub_prod_name,

       p.package_class,

       so.sap_so_code,

       DECODE(so.order_type,'E','工程','量产') ORDER_TYPE,

       so.cust_lot,

       so.cust_po_code,

       so.cust_code,

       so.cust_name,

       floor(so.order_qty) order_qty,

       case 

         when p.package_class ='FO-eWLB-F'and (so.round_form='U' or so.round_form is null)  then --向上取整 

         CEIL(so.order_qty/(select attr.attr_val from  md_product_layer lay ,md_product_layer_attr attr where p.row_id=lay.prod_id and attr.prod_layer_id=lay.row_id and lay.del_flag=0 and attr.del_flag=0 and  attr.attr_code='D0004'))     

         when p.package_class ='FO-eWLB-F'and so.round_form='D' then --向下取整 

         floor(so.order_qty/(select attr.attr_val from  md_product_layer lay ,md_product_layer_attr attr where p.row_id=lay.prod_id and attr.prod_layer_id=lay.row_id and lay.del_flag=0 and attr.del_flag=0 and  attr.attr_code='D0004'))      

         else sw.wafer_qty end wafer_qty,  

       case when so.cust_po_code='假片' then 0 when p.package_class in ('BUMP','Bumping') then 0 else sw.wafer_die_qty end wafer_die_qty,

       null  fo_wafer_qty,

       wo.wo_code,

       mo.mo_code,

       lot.lot_code

  from so_sale_order so

left join (select sw.so_id, sum(sw.wafer_qty) wafer_qty ,sum(sw.wafer_die_qty ) wafer_die_qty from so_sale_order_wafer sw where sw.del_flag=0 group by sw.so_id ) sw on sw.so_id=so.row_id 

left join wo_work_order wo on so.row_id=wo.so_id and wo.del_flag=0

left join mo_order mo  on wo.row_id=mo.wo_id and mo.del_flag=0

left join lot_info lot  on mo.row_id=lot.mo_id and lot.del_flag=0

left join md_product p on so.prod_id=p.row_id and p.del_flag=0

left join sm_user sm  on so.create_user_id =sm.row_id 

--left join ( select g.* from md_prod_segment_group g  where g.del_flag=0 and   g.WAFER_U='1' ) fo on p.row_id= fo.prod_id 

where so.prod_line='W' 

and so.del_flag=0

--and so.biz_status='Y'

and  (/*lot.lot_status='LotDispatch' or */lot.lot_code is null or mo.mo_code is null or wo.wo_code is null )

union all

select so.so_date,

       sm.user_name, 

       fo.sub_prod_name prod_name,

p.wafer_size,

       '磨划型号' sub_prod_name,

       p.package_class,

       so.sap_so_code,

       DECODE(so.order_type,'E','工程','量产') ORDER_TYPE,

       so.cust_lot,

       so.cust_po_code,

       so.cust_code,

       so.cust_name,

sw.wafer_qty order_qty,

       sw.wafer_qty wafer_qty,

       null  wafer_die_qty,

null  fo_wafer_qty,

       wo.wo_code,

       mo.mo_code,

       lot.lot_code

  from so_sale_order so

left join (select sw.so_id, sum(sw.wafer_qty) wafer_qty ,sum(sw.wafer_die_qty ) wafer_die_qty from so_sale_order_wafer sw where sw.del_flag=0 group by sw.so_id ) sw on sw.so_id=so.row_id 

left join wo_work_order wo on so.row_id=wo.so_id and wo.del_flag=0

left join mo_order mo  on wo.row_id=mo.wo_id and mo.del_flag=0

left join lot_info lot  on mo.row_id=lot.mo_id and lot.del_flag=0

left join md_product p on so.prod_id=p.row_id and p.del_flag=0

left join sm_user sm  on so.create_user_id =sm.row_id 

left join ( select g.* from md_prod_segment_group g  where g.del_flag=0 and   g.WAFER_U='1' ) fo on p.row_id= fo.prod_id 

where so.prod_line='W' 

and so.del_flag=0

--and so.biz_status='Y'

and  (/*lot.lot_status='LotDispatch' or */lot.lot_code is null or mo.mo_code is null or wo.wo_code is null )

and p.package_class='FO-eWLB-F') t where 

t.so_date >= sysdate - 30

order by t.sap_so_code ,t.sub_prod_name desc